linear & power amplifiers - chip 3 3 - 8 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com hmc441 gaas phemt mmic medium power amplifier, 6 - 18 ghz v06.0508 general description features functional diagram the hmc441 is an efficient gaas phemt mmic medium power ampli er which operates between 6 and 18 ghz*. the ampli er provides 15.5 db of gain, +22 dbm of saturated power, and 23% pae from a +5v supply voltage. an optional gate bias is provided to allow adjustment of gain, rf output power, and dc power dissipation. the hmc441 ampli er can easily be integrated into multi-chip-modules (mcms) due to its small size. the backside of the die is both rf and dc ground, simplifying the assembly process and reducing performance variation. all data is tested with the chip in a 50 ohm test xture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils). gain: 15.5 db saturated power: +22 dbm @ 23% pae single supply voltage: +5v w/ optional gate bias 50 ohm matched input/output die size: 0.94 x 0.94 x 0.1 mm electrical speci cations, t a = +25 c, vdd1 = vdd2 = 5v, vgg1 = vgg2 = open typical applications the hmc441 is ideal for: ? point-to-point and point-to-multi-point radios ? vsat ? lo driver for hmc mixers ? military ew & ecm parameter min. typ. max. min. typ. max. min. typ. max. min. typ. max. units frequency range 7.0 - 8.0 8.0 - 12.5 12.5 - 14.0 14.0 - 15.5 ghz gain 13 15.5 14 16.5 13 15.5 12 14.5 db gain variation over temperature 0.015 0.02 0.015 0.02 0.015 0.02 0.015 0.02 db/ c input return loss 10 13 15 14 db output return loss 14 17 23 18 db output power for 1 db compression (p1db) 15.5 18.5 16 19 17 20 17 20 dbm saturated output power (psat) 17 20 18 21 19 22 19 22 dbm output third order intercept (ip3) 29 31 32 32 dbm noise figure 5.0 4.5 4.5 4.5 db supply current (idd) 90 115 90 115 90 90 115 ma vgg1, vgg2: optional gate bias *contact hmc for electrical spec limits for 6-7 & 15.5 - 18 ghz.
linear & power amplifiers - chip 3 3 - 9 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com input return loss vs. temperature output return loss vs. temperature broadband gain & return loss gain vs. temperature p1db vs. temperature psat vs. temperature -30 -25 -20 -15 -10 -5 0 5 10 15 20 4 6 8 10 12 14 16 18 20 s21 s11 s22 response (db) frequency (ghz) 0 4 8 12 16 20 6 8 10 12 14 16 18 +25 c +85 c -55 c gain (db) frequency (ghz) -20 -16 -12 -8 -4 0 6 8 10 12 14 16 18 +25 c +85 c -55 c return loss (db) frequency (ghz) -35 -30 -25 -20 -15 -10 -5 0 6 8 10 12 14 16 18 +25 c +85 c -55 c return loss (db) frequency (ghz) 15 17 19 21 23 25 6 8 10 12 14 16 18 +25 c +85 c -55 c p1db (dbm) frequency (ghz) 15 17 19 21 23 25 6 8 10 12 14 16 18 +25 c +85 c -55 c psat (dbm) frequency (ghz) hmc441 v06.0508 gaas phemt mmic medium power amplifier, 6 - 18 ghz
linear & power amplifiers - chip 3 3 - 10 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com power compression @ 11 ghz output ip3 vs. temperature noise figure vs. temperature gain & power vs. supply voltage @ 11 ghz reverse isolation vs. temperature power compression @ 15 ghz 0 5 10 15 20 25 30 -10 -6 -2 2 6 10 pout (dbm) gain (db) pae (%) pout (dbm), gain (db), pae (%) input power (dbm) 0 5 10 15 20 25 30 -10 -6 -2 2 6 10 14 pout (dbm) gain (db) pae (%) pout (dbm), gain (db), pae (%) input power (dbm) 16 20 24 28 32 36 6 8 10 12 14 16 18 +25 c +85 c -55 c ip3 (dbm) frequency (ghz) 0 2 4 6 8 10 6 8 10 12 14 16 18 +25 c +85 c -55 c noise figure (db) frequency (ghz) 10 12 14 16 18 20 22 24 2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 gain p1db psat gain (db), p1db (dbm), psat (dbm) vdd (v) -60 -50 -40 -30 -20 -10 0 6 8 10 12 14 16 18 +25 c +85 c -55 c isolation (db) frequency (ghz) hmc441 v06.0508 gaas phemt mmic medium power amplifier, 6 - 18 ghz
linear & power amplifiers - chip 3 3 - 11 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com absolute maximum ratings drain bias voltage (vdd1, vdd2) +5.5 vdc gate bias voltage (vgg1,vgg2) -8 to 0 vdc rf input power (rfin)(vdd = +5vdc) +20 dbm channel temperature 175 c continuous pdiss (t= 85 c) (derate 8.5 mw/c above 85 c) 0.76 w thermal resistance (channel to die bottom) 118 c/ w storage temperature -65 to +150 c operating temperature -55 to +85 c vdd (v) idd (ma) +4.5 88 +5.0 90 +5.5 92 +2.7 80 +3.0 82 +3.3 83 typical supply current vs. vdd note: ampli er will operate over full voltage ranges shown above gain, power & output ip3 vs. gate voltage @ 12 ghz 0 5 10 15 20 25 30 35 0 30 60 90 120 150 180 210 -1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 gain p1db psat ip3 idd gain (db), p1db (dbm), psat (dbm), ip3 (dbm) idd (ma) vgg1, vgg2 gate voltage (v) electrostatic sensitive device observe handling precautions hmc441 v06.0508 gaas phemt mmic medium power amplifier, 6 - 18 ghz
linear & power amplifiers - chip 3 3 - 12 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com pad descriptions pad number function description interface schematic 1rfin this pad is ac coupled and matched to 50 ohms. 2, 3 vdd1, vdd2 power supply voltage for the ampli er. an external bypass capacitor of 100 pf is required. 4rfout this pad is ac coupled and matched to 50 ohms. 5, 6 vgg1, vgg2 optional gate control for ampli er. if left open, the ampli er will run at standard current. negative voltage applied will reduce current. outline drawing notes: 1. all dimensions are in inches [mm] 2. die thickness is .004 3. typical bond is .004 square 4. backside metallization: gold 5. bond pad metallization: gold 6. backside metal is ground. 7. connection not required for unlabeled bond pads. die packaging information [1] standard alternate gp-2 (gel pack) [2] [1] refer to the packaging information section for die packaging dimensions. [2] for alternate packaging information contact hittite microwave corporation. hmc441 v06.0508 gaas phemt mmic medium power amplifier, 6 - 18 ghz
linear & power amplifiers - chip 3 3 - 13 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com (a) assembly for single supply voltage operation hmc441 v06.0508 gaas phemt mmic medium power amplifier, 6 - 18 ghz
linear & power amplifiers - chip 3 3 - 14 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com (b) assembly with optional gate bias voltage operation hmc441 v06.0508 gaas phemt mmic medium power amplifier, 6 - 18 ghz
linear & power amplifiers - chip 3 3 - 15 for price, delivery, and to place orders, please contact hittite microwave corporation: 20 alpha road, chelmsford, ma 01824 phone: 978-250-3343 fax: 978-250-3373 order on-line at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm microstrip transmission lines on 0.127mm (5 mil) thick alumina thin lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin lm substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. one way to accom- plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (figure 2). microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waffle or gel based esd protec- tive containers, and then sealed in an esd protective bag for shipment. once the sealed esd protective bag has been opened, all die should be stored in a dry nitrogen environment. cleanliness: handle the chips in a clean environment. do not attempt to clean the chip using liquid cleaning systems. static sensitivity: follow esd precautions to protect against esd strikes. transients: suppress instrument and bias supply transients while bias is applied. use shielded signal and bias cables to minimize inductive pick-up. general handling: handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. the surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or ngers. mounting the chip is back-metallized and can be die mounted with ausn eutectic preforms or with electrically conductive epoxy. the mounting surface should be clean and at. eutectic die attach: a 80/20 gold tin preform is recommended with a work surface temperature of 255 c and a tool temperature of 265 c. when hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 c. do not expose the chip to a temperature greater than 320 c for more than 20 seconds. no more than 3 seconds of scrubbing should be required for attachment. epoxy die attach: apply a minimum amount of epoxy to the mounting surface so that a thin epoxy llet is observed around the perimeter of the chip once it is placed into position. cure epoxy per the manufacturers schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 c and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recom- mended. use the minimum level of ultrasonic energy to achieve reliable wirebonds. wirebonds should be started on the chip and terminated on the package or substrate. all bonds should be as short as possible <0.31mm (12 mils). 0.102mm (0.004?) thick gaas mmic wire bond rf ground plane 0.127mm (0.005?) thick alumina thin film substrate 0.076mm (0.003?) figure 1. 0.102mm (0.004?) thick gaas mmic wire bond rf ground plane 0.254mm (0.010?) thick alumina thin film substrate 0.076mm (0.003?) figure 2. 0.150mm (0.005?) thick moly tab hmc441 v06.0508 gaas phemt mmic medium power amplifier, 6 - 18 ghz
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